heat dissipators for plastic case, case-mounted semiconductors horizontally mounted, light-weight, low-cost heat dissipators .l'4i'ger pb series offers greater heat dis- sipation, additional hole patterns, and dual semiconductor mounting capability. .only one mounting screw required to secure dissipators to semiconductor and circuit board. .most effective l:1eat dissipator in perfor- mance/unit cost. .accommodates all flat plastic case power semiconductors. .efficient design requires just. 71 sq. in. of board area (pa series) and .31" to .5" height above board. PC1-1CB o 2 3 4 5 6 7 power dissipated (watts) .thermal resistance case to sink is 0.9.1.1 'c/w w/joint compound. .derate 2.4 'c/watt for unplated part in natural convection only. (i~)1u l..j .375 (9.53) '~ ordering information max. unplated weight (grams) to-126, to-127, to-220 pc1.iu pci-icb pc1.1b 1.9 dimensions are for reference use only. contact ierc for , dimensions with tolerances or standard part drawings. pa1 series 0 1 2 3 4 5 6 7 8 9 10111213 1415 power dissipated (watts) .thermal resistance case to sink is 0.9.1.1 c/w w/joint compound. .uprate 2.4 c/watt for black part in natural convection only. .derate 0.6 c/watt for insulube~ part in natural convection only. ordering information j .04 .50 (1.02) (12.70) l , r ierc part no. max. weight (grams) 2.0 2.0 semiconductor accommodated unplated i com'l. black i mil. black anodize anodize insulube~ 448 pal pal-l palu pal-lu palcb pal.lcb palo pa1.lo undrllled to-126, to-1n to-220 dimensions are for reference use only. contectlerc for dimensions with tolerances or standsrd part drawings. note: see page iv for other finishes. 2.4
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